Which ab glue potting machines is the most suitable for PCB waterproof encapsulation?

 Which type of glue potting machine is the most suitable for PCB waterproof encapsulation, which requires comprehensive consideration of a variety of factors, including the precision of the two component glue potting machine, efficiency, applicable glue type, process requirements, cost and so on.

In order to find the most suitable for PCB waterproof encapsulation glue potting machine, you need to understand the characteristics and scope of application of different types of glue potting machine, PCB waterproof encapsulation of the specific process requirements, as well as the type of glue applicable to the process and glue potting machine parameter settings.

The following are several types of glue potting machine suitable for PCB waterproof encapsulation and related features

1. Automatic Glue Dispensing Machine

Advantages

High Precision Control: Equipped with a precision mixing valve, it achieves glue volume control accuracy of ±2%, suitable for micron-level dispensing requirements. It can precisely cover circuit board components and solder joints, ensuring waterproof effects. Supports path programming, adapting to different circuit board sizes and complex trace structures, suitable for both small electronic devices and large industrial PCBs 2.

Strong Intelligence and Adaptability: Built-in temperature control modules (0–80°C) accommodate variations in glue viscosity, ensuring optimal fluidity and curing effects. Supports a wide range of dual-component glue ratios (e.g., 1:1 to 10:1 for epoxy resin, silicone, or polyurethane), meeting diverse waterproof encapsulation needs 2.

High Efficiency and Stability: Automated continuous operation with dispensing speeds of 10–500g/min, significantly improving production efficiency. Features automatic cleaning and anti-drip functions, reducing downtime and maintenance costs 2.

Flexible Processes: Optional glue dispensing valves (contact/non-contact) and vision positioning systems enable high-precision filling, sealing, or localized dispensing, adaptable to various PCB designs and waterproofing requirements 2.

Disadvantages: Higher equipment costs and a steeper learning curve for operators, requiring technical training and support.

Automatic dual two-component potting machine SEC-S3030-C

● The unique motion controller of Second Intelligent, combined with advanced algorithms and high-precision three-axis manipulator, can realize three-dimensional high-speed and accurate motion

● By accurately controlling the metering motor, the precise proportion of two-component glue, automatic mixing and automatic quantitative glue are achieved
It has vacuum feeding and vacuum degassing, and can be equipped with heating, stirring, automatic cleaning, pressure monitoring and other functions to cope with various complex glue environments

The operating system is stable, the operation interface is friendly, and the cost performance is high!

 

2. In-line Glue Dispensing Machine

Advantages

Full Automation: Seamlessly integrates into assembly lines for fully automated processes, from PCB conveying to gluing and curing. Ideal for large-scale production, as proven in applications like battery covers and bulb lights, ensuring consistent quality and throughput 45.

Precision Control: Advanced systems regulate glue volume, speed, and positioning accurately, minimizing human error and ensuring uniform waterproofing results.

Labor Savings: Eliminates manual operations, reducing labor costs and workload while improving product consistency.

Disadvantages: High initial investment, requires adequate space and optimized production line layout.

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