What are the applications of fluid dispensing machines in the field of semiconductor components?
Fluid dispensers are widely used and critical in the field of semiconductor components. They are mainly used for high-precision and high-reliability fluid dispensing to meet the requirements of miniaturization, complexity and high consistency in semiconductor manufacturing. The following are its main application scenarios and technical features: 1. Equipment parameter setting 1. Chip packaging Underfill: In flip chip packaging, the dispenser accurately injects epoxy resin glue into the gap between the chip and the substrate. After curing, it relieves thermal stress and improves mechanical strength and reliability. SMT automatic glue dispenser SEC-DH600L Second Intelligent high precision smt automatic glue dispenser machine apply epoxy resin to the bottom of the PCB board for underfill Second Intelligent smt automatic glue dispenser automation SEC-DH600L has the following advantages: ● CCD visual programming precise positioning, visual correctio...