Thermally Conductive Paste Dispensing– The Hot Spot Solution Application
The application of dispensing thermally conductive paste is a key technology for solving the “hot spot” problem in electronic devices. Below, I will systematically explain it to you, including its principles, solutions, application cases, and best practices. 1.Core Concept: Why Apply Thermally Conductive Paste? — From “Surface Heat Dissipation” to “Precision Heat Dissipation” Traditional methods of applying thermal paste using scraping or manual application have several problems: ● Uneven Thickness: Easily creates areas of varying thickness, affecting overall heat transfer efficiency. ● Air Bubbles: Manual application easily introduces air, forming insulating bubbles. ● Inability to Handle Complex Structures: Difficult to achieve uniform coverage for chips with inconsistent heights or areas containing components. The core advantages of thermal paste application technology lie in its precision, controllability, and automation. It can: 1.Precise Positioning: Accurately apply ...