Precision dispensing of thermal conductive gel for high-performance computer CPU/GPU cooling modules?
Case Study on Thermal Gel Dispensing in Computer Heat Sinks: Background, Challenges, Solutions, Process Key Points, and Benefit Analysis. I. Project Background With the continuous increase in the power consumption of computer CPUs and GPUs (especially gaming laptops, high-end desktops, and servers), heat dissipation has become crucial in determining performance stability and lifespan. In traditional heat dissipation solutions, in addition to the thermal grease on the core components, a large number of surrounding heat-generating components such as capacitors, MOSFETs, and memory chips need to be effectively cooled. These components vary in height and spacing, and are sensitive to stress. Traditional thermal pads (gap pads) suffer from uneven contact, limited thickness selection, and low efficiency of manual placement when dealing with complex, multi-height coplanar heat dissipation. Therefore, the industry is shifting towards solutions using thermal gel combined wit...