Precision dispensing of thermal conductive gel for high-performance computer CPU/GPU cooling modules?

 Case Study on Thermal Gel Dispensing in Computer Heat Sinks: Background, Challenges, Solutions, Process Key Points, and Benefit Analysis.

I. Project Background

 

With the continuous increase in the power consumption of computer CPUs and GPUs (especially gaming laptops, high-end desktops, and servers), heat dissipation has become crucial in determining performance stability and lifespan. In traditional heat dissipation solutions, in addition to the thermal grease on the core components, a large number of surrounding heat-generating components such as capacitors, MOSFETs, and memory chips need to be effectively cooled.

 

These components vary in height and spacing, and are sensitive to stress. Traditional thermal pads (gap pads) suffer from uneven contact, limited thickness selection, and low efficiency of manual placement when dealing with complex, multi-height coplanar heat dissipation. Therefore, the industry is shifting towards solutions using thermal gel combined with automated dispensing technology.

Precision dispensing of thermal conductive gel for high-performance computer CPU/GPU cooling modules?

 

Case Study on Thermal Gel Dispensing in Computer Heat Sinks: Background, Challenges, Solutions, Process Key Points, and Benefit Analysis.

 

1.Project Background

With the continuous increase in the power consumption of computer CPUs and GPUs (especially gaming laptops, high-end desktops, and servers), heat dissipation has become crucial in determining performance stability and lifespan. In traditional heat dissipation solutions, in addition to the thermal grease on the core components, a large number of surrounding heat-generating components such as capacitors, MOSFETs, and memory chips need to be effectively cooled.

 

These components vary in height and spacing, and are sensitive to stress. Traditional thermal pads (gap pads) suffer from uneven contact, limited thickness selection, and low efficiency of manual placement when dealing with complex, multi-height coplanar heat dissipation. Therefore, the industry is shifting towards solutions using thermal gel combined with automated dispensing technology.

Ⅱ.Technical Challenges

 

1.High Filling Accuracy Requirements: Component gaps range from 0.1mm to 3mm, requiring complete filling without air bubbles, while preventing excessive overflow that could contaminate solder joints or gold fingers.

III. Solution

 1.Material Selection:

● Use a single-component silicone-based thermally conductive gel that can cure at room temperature or with heat.

● Key parameters: Thermal conductivity 1.5-3.0 W/m·K, viscosity range approximately 50,000 – 200,000 cP (selected according to specific process), low exudation, UL94 V-0 flame retardant rating.

Second Intelligent has played an important role in theresearch, development, manufacturing, pre-sales and after-sales services of fluid dispensing robot, potting and coating solutions which range from various types of automatic fluid dispensing, potting, two-component potting machines and coating machines with desktop, free-standing, inline or cobot combined systems, and widely used in global electrical, electronics, home appliances, automobile, telecom, pharmaceutical, automotive electronics, semiconductor, aerospace, LED and more.

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