Glue potting machine in the application of electronic packaging: how to avoid air bubbles, overflow glue and other common problems?

In the field of electronic packaging, the glue potting process directly affects the sealing, insulation and long-term reliability of the product. However, problems such as bubbles, glue overflow, and uneven glue amount often trouble production engineers, resulting in reduced yield and even product failure. This article will deeply analyze the common problems of the glue potting process and provide solutions such as vacuum degassing, precise metering, and process optimization to help you improve the quality and efficiency of glue potting. 1. The key role of glue potting in electronic packaging Potting refers to potting liquid glue (such as epoxy resin, silicone, polyurethane, etc.) into specific areas of electronic components or PCB boards to achieve waterproof, shockproof, insulation, heat dissipation and other functions. Typical applications include: ● Power module potting (such as new energy vehicle electronic control unit) ● LED drive circuit packagi...