secondintelligent

  Thermal interface materials are key materials for solving the heat dissipation bottleneck of modern electronic devices. Dispensing technology has become the mainstream process for TIM applications due to its high automation, high flexibility and suitability for complex shapes, especially in high-power, high-value fields such as electric vehicles. Ι. Core Concept: Why Are TIM and Dispensing Processes Critical for Electric Vehicles? 1.The Extreme Importance of Thermal Management:  Core components of electric vehicles (such as battery packs, electric drive systems, onboard chargers, power electronics, etc.) generate significant heat during operation.   Overheating directly leads to performance degradation, reduced lifespan, and even safety incidents. Efficient thermal management is the cornerstone for ensuring vehicle power, safety, and reliability. 2.Role of TIM:  Between two seemingly flat solid surfaces (e.g., chip and heat sink), numerous microscopic voids fi...

  Dam sealing dispensing is a high-precision dispensing technique used in electronic packaging and other industrial applications, primarily aimed at preventing liquid material leakage and providing structural support. Dam sealing dispensing involves applying adhesive in specific areas to create a fixed dam structure, which prevents adhesive overflow and ensures precision and effectiveness in dispensing. Dam sealing adhesives are typically categorized into two types: Single-component dam sealing adhesive: Easy to use and ready for immediate application. Second Intelligent Equipment Co., Ltd. offers single-component dispensing machines that are easy to program and operate, featuring the following characteristics to better meet customer demands for dispensing processes: 1.The platform and X/Y module bases are made using mineral casting, with critical surfaces processed by grinding to ensure higher precision and stability. 2.A gantry structure allows for high load-bearing capacity and ...

  Mectronics Maketing Service , which strives to be the India’s  leading distribution organization for PCB assembly company who had already become our Indian distributor since 2024 , is attending the Indian exhibition. Productronica India 2025, held from  September 17 to 19   at the  Bangalore International Exhibition Centre (BIEC)    , from Second intelligent are also showcase our desktop machine  E380  solutions at  booth H4.D31  ,this is the second time that we have presented our solutions for the electronics industry at Mectronic’s exhibition. Productronica India 2025,  together with Electronica India, is the largest and most professional electronics trade fair for electronic components, systems, applications, and solutions in South Asia chain.As South Asia’s premier and highly professional top-tier electronics event, this exhibition showcased a collection of cutting-edge technologica...

  Dear  Valued  Customers and Partners, Greetings! We are pleased to extend an invitation to you for this year’s  Productronica India.   the premier exhibition for electronics development and production in South Asia.jointly with our Indian distributor Mectronics . The event is scheduled to take place from  17th to 19th September 2025  at  the Bangalore International Exhibition Centre (BIEC), Bengaluru. Productronica India 2025 Exhibition Dates:  September 1 7 -1 9 , 202 5 Venue:  Bangalore International Exhibition Centre (BIEC)  ，  Bengaluru Booth Number:  H 4 .D 31 Exhibited Machines: Two-Component Automatic Potting Machine SEC-S3030-C . In today’s rapidly evolving world of fluid manufacturing, staying ahead of the competition is crucial. Second intelligent , we understand the importance of staying at the forefront of technology and providing global services. We are committed to making a decisive differenc...

  Underfilling chips on PCB boards is a precision process primarily used for chips with ball grid arrays on their undersides, such as BGAs (Ball Grid Arrays) and CSPs (Chip-Scale Packages).   Below, I will explain the procedure in detail, covering its purpose, materials, equipment, steps, and precautions.   I. Why Use Underfill? The primary purpose is to enhance the mechanical strength and long-term reliability of chips, especially in products operating under harsh conditions.   1. Resist Mechanical Stress:  Prevents solder joint cracking caused by PCB bending, vibration, or impact. Underfill is critical for portable devices like smartphones during drops.   2. Mitigating Thermal Stress:  Chips and PCB substrates (typically FR-4) have differing coefficients of thermal expansion (CTE). During thermal cycling, this mismatch generates stresses that cause solder joint fatigue failure. Underfill material evenly distributes these stresses, protecting solder ...