secondintelligent

  Case Study on Thermal Gel Dispensing in Computer Heat Sinks: Background, Challenges, Solutions, Process Key Points, and Benefit Analysis. I. Project Background   With the continuous increase in the power consumption of computer CPUs and GPUs (especially gaming laptops, high-end desktops, and servers), heat dissipation has become crucial in determining performance stability and lifespan. In traditional heat dissipation solutions, in addition to the thermal grease on the core components, a large number of surrounding heat-generating components such as capacitors, MOSFETs, and memory chips need to be effectively cooled.   These components vary in height and spacing, and are sensitive to stress. Traditional thermal pads (gap pads) suffer from uneven contact, limited thickness selection, and low efficiency of manual placement when dealing with complex, multi-height coplanar heat dissipation. Therefore, the industry is shifting towards solutions using thermal gel combined wit...

  Dispensing and potting machines are primarily employed in the manufacturing of new energy vehicles within the three-electric systems ( power batteries, drive motors, and electronic control systems ). Through high precision, automation, and intelligent control, they fulfil the industry requirements for new energy vehicle production.     1.What are the “Three Electrics”in New Energy Vehicles? ( 1 ) Battery system    Equivalent to the engine in a petrol vehicle, it serves as the power source. Functioning as an energy storage device, it stores direct current (DC) electricity. This is essential because, unlike trams that operate on overhead lines, vehicles cannot be continuously powered by an external source during operation. ( 2 ) Electric drive system    This functions as the equivalent of a petrol vehicle’s gearbox. The battery supplies power to the motor via the motor controller, and the motor’s rotation propels the vehicle fo...

  In precision manufacturing and high-end electronics, material performance directly determines product reliability and lifespan. Silicone, a high-performance synthetic polymer, is the preferred material for many critical applications due to its extremely high heat resistance, excellent elasticity, superior electrical insulation Precisely proportioned mixing, automatic quantitative potting 1. Silicone Material Characteristics and Dispensing Process Challenges Silicone materials are mainly divided into two categories: single-component (1K, RTV-1) and two-component (2K, RTV-2): Single-component silicone (RTV-1): Cures by contact with moisture in the air, easy to operate, suitable for sealing, caulking, etc. Two-component silicone (RTV-2): Cures by a chemical reaction after precise mixing of component A (base adhesive) and component B (curing agent). Its curing process is unaffected by ambient humidity, and its properties (such as hardness and modulus) have a wide adjustable range, of...

  In the electronics industry, ensuring the long-term reliability of   PCB assemblies   requires more than soldering quality—it also depends on   waterproofing, moisture protection, vibration resistance, and anti-static insulation . A client approached  Second Intelligent  seeking a fully automated solution to dispense  Single-Component, Moisture-Curable, Elastic Adhesive (White)  on their PCB boards to enhance environmental protection and component robustness. Their adhesive was supplied in a  310ml cartridge , commonly used for RTV-type moisture-curing elastomers with medium-to-high viscosity.   1.Customer Background & Requirements The client manufactures  LED lighting modules  and electronic control boards. Their PCB contains multiple sensitive components—LEDs, sensors, ICs, connectors—and requires precise bead and dot dispensing to achieve full protective coverage. Customer Pain Points Components closely spaced →  ...

  The application of dispensing thermally conductive paste is a key technology for solving the “hot spot” problem in electronic devices. Below, I will systematically explain it to you, including its principles, solutions, application cases, and best practices. 1.Core Concept: Why Apply Thermally Conductive Paste? — From “Surface Heat Dissipation” to “Precision Heat Dissipation” Traditional methods of applying thermal paste using scraping or manual application have several problems: ● Uneven Thickness: Easily creates areas of varying thickness, affecting overall heat transfer efficiency. ● Air Bubbles: Manual application easily introduces air, forming insulating bubbles. ● Inability to Handle Complex Structures: Difficult to achieve uniform coverage for chips with inconsistent heights or areas containing components. The core advantages of thermal paste application technology lie in its precision, controllability, and automation. It can: 1.Precise Positioning:  Accurately apply ...