Application cases of dispensing machines in conductive adhesive FIP for new energy vehicles!

 The application of dispensing machines in conductive adhesive for FIP (Fiber-in-the-Pack) in new energy vehicles is a very typical and crucial case. FIP in new energy vehicles is mainly used for electromagnetic shielding and grounding, requiring extremely high precision in the dispensing process.

 

Below is a detailed analysis of an application case:

Application Case: Electromagnetic Shielding Sealing for New Energy Vehicle Battery Management System (BMS) Enclosures


1.Background and Requirements

● Component: The Battery Management System (BMS) serves as the “brain” of electric vehicles. Its housing must rigorously protect internal precision electronic components from electromagnetic interference (EMI). Simultaneously, the housing itself requires excellent sealing to prevent ingress of water, dust, and corrosive gases.

 

● Traditional Solution: Utilization of metal gaskets or conductive foam. However, this approach may suffer from inadequate sealing, uneven installation pressure, and long-term compression set failure.

 

● FIP Solution: Conductive particles (e.g., silver, silver-clad copper, nickel) are suspended in silicone or fluorosilicone elastomers to form a conductive sealant that can be dispensed and molded. This solution delivers both outstanding environmental sealing (IP67/IP68) and exceptional electromagnetic shielding performance (typically 60-100dB) by creating continuous conductive pathways through the particles.



Automatic In-line PCB Glue Dispensing Machine SEC-DH400L

 

Second Intelligent In-line Automated Glue Dispensing Machine SEC-DH400L adopts an integrated mineral casting design, with ultra-high precision and super stability, powerful expansion capabilities, and can realize ion cleaning, dispensing, detection, UV exposure and other functions;

Adopting a gantry structure, it can bear large loads, stable structure, and a powerful CCD visual positioning system, which can meet the requirements of Mark point positioning, edge positioning, and 3D scanning positioning; strong scalability, and can expand AOI detection 3D detection, UV exposure curing and other functions;

Strong platform compatibility, contact and non-contact dispensing, single-head and multi-head synchronous dispensing, automatic compensation and adjustment of double-head spacing, five-axis dispensing function based on needle A/R displacement, etc.

 

2.Challenges in Dispensing Processes

FIP materials are inherently non-Newtonian fluids, exhibiting extreme sensitivity to process parameters:

● Consistency: Shielding effectiveness critically depends on continuous, uniform, and uninterrupted adhesive bead formation. Any air bubbles, breaks, or thickness variations create “gap antennas,” significantly degrading shielding performance.

● Precision and Complex Pathways: BMS housings often feature irregular shapes with corners and radii, demanding strict control over bead width and height (typically 1-2mm wide, 0.5-1.5mm high).

● Material Handling: FIP adhesives contain high metal filler content, prone to settling and abrasion. Continuous, gentle mixing is required without introducing air.

● Adhesion and Curing: Requires strong bonding to metal (aluminum, steel) or plastic housings. Curing conditions (heat or humidity) must align with production line cycle times.

 

3.Dispensing Machine Solution (System Configuration)

To address these challenges, a comprehensive dispensing system typically includes:

● High-Precision Dispensing Platform:

Robotic/Motion System: Utilizes high-rigidity, high-repeatability linear motors or precision ball screw modules to ensure precise reproduction of complex 3D paths.


2.Challenges in Dispensing Processes

FIP materials are inherently non-Newtonian fluids, exhibiting extreme sensitivity to process parameters:


5.Value and Advantages

Reliable Performance: Achieves seamless shielding and sealing, significantly enhancing BMS operational reliability in complex electromagnetic environments.


https://secondintelligent.com/industry-news/dispensing-machines-in-conductive-adhesive-fip/

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